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AM3352BZCZD80 参数 Datasheet PDF下载

AM3352BZCZD80图片预览
型号: AM3352BZCZD80
PDF下载: 下载PDF文件 查看货源
内容描述: 的Sitara AM335x ARM Cortex-A8的微处理器(MPU ) [Sitara AM335x ARM Cortex-A8 Microprocessors (MPUs)]
分类和应用: 微控制器和处理器外围集成电路微处理器时钟
文件页数/大小: 236 页 / 2887 K
品牌: TI [ TEXAS INSTRUMENTS ]
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AM3359, AM3358, AM3357  
AM3356, AM3354, AM3352  
SPRS717F OCTOBER 2011REVISED APRIL 2013  
www.ti.com  
AM335x  
(ZCE Package)  
RTC_XTALIN  
RTC_XTALOUT  
Optional Rbias  
Optional Rd  
Crystal  
C1  
C2  
A. Oscillator components (Crystal, C1, C2, optional Rbias and Rd) must be located close to the AM335x package.  
Parasitic capacitance to the printed circuit board (PCB) ground and other signals should be minimized to reduce noise  
coupled into the oscillator.  
B. C1 and C2 represent the total capacitance of the respective PCB trace, load capacitor, and other components  
(excluding the crystal) connected to each crystal terminal. The value of capacitors C1 and C2 should be selected to  
provide the total load capacitance, CL, specified by the crystal manufacturer. The total load capacitance is CL  
=
[(C1*C2)/(C1+C2)] + Cshunt, where Cshunt is the crystal shunt capacitance (C0) specified by the crystal manufacturer  
plus any mutual capacitance (Cpkg + CPCB) seen across the AM335x RTC_XTALIN and RTC_XTALOUT signals. For  
recommended values of crystal circuit components, see Table 4-5.  
Figure 4-11. OSC1 (ZCE Package) Crystal Circuit Schematic  
AM335x  
(ZCZ Package)  
RTC_XTALIN  
VSS_RTC  
RTC_XTALOUT  
C1  
C2  
Optional Rd  
Crystal  
Optional Rbias  
A. Oscillator components (Crystal, C1, C2, optional Rbias and Rd) must be located close to the AM335x package.  
Parasitic capacitance to the printed circuit board (PCB) ground and other signals should be minimized to reduce noise  
coupled into the oscillator.  
B. C1 and C2 represent the total capacitance of the respective PCB trace, load capacitor, and other components  
(excluding the crystal) connected to each crystal terminal. The value of capacitors C1 and C2 should be selected to  
provide the total load capacitance, CL, specified by the crystal manufacturer. The total load capacitance is CL  
=
[(C1*C2)/(C1+C2)] + Cshunt, where Cshunt is the crystal shunt capacitance (C0) specified by the crystal manufacturer  
plus any mutual capacitance (Cpkg + CPCB) seen across the AM335x RTC_XTALIN and RTC_XTALOUT signals. For  
recommended values of crystal circuit components, see Table 4-5.  
Figure 4-12. OSC1 (ZCZ Package) Crystal Circuit Schematic  
110  
Power and Clocking  
Copyright © 2011–2013, Texas Instruments Incorporated  
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Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352  
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