ADS8284
www.ti.com................................................................................................................................................................................................... SLAS628–MARCH 2009
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION(1)
MAXIMUM
INTEGRAL
LINEARITY
MAXIMUM
DIFFERENTIAL
LINEARITY
NO MISSING
CODES AT
RESOLUTION
TRANSPORT
MEDIA
QUANTITY
PACKAGE
TYPE
PACKAGE
DESIGNATOR
TEMPERATURE
RANGE
ORDERING
INFORMATION
MODEL
(LSB)
(LSB)
(BIT)
ADS8284IBRGCT
ADS8284IBRGCR
ADS8284IRGCT
ADS8284IRGCR
250
2000
250
ADS8284lB
ADS8284l
±2.5
+1.5/–1
18
–40°C to
85°C
64-pin QFN
RGC
±4.5
+1.5/–1
18
2000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
VALUE
VEE–0.3 to VCC + 0.3
-0.3 to 18
UNIT
V
CH(i) to AGND (both P and M inputs)
VCC to VEE
V
+VA to AGND
–0.3 to 7
V
+VBD to BDGND
–0.3 to 7
V
ADC control digital input voltage to GND
ADC control digital output to GND
Multiplexer control digital input voltage to GND
Power control digital input voltage to GND
Operating temperature range
Storage temperature range
–0.3 to (+VBD + 0.3)
–0.3 to (+VBD + 0.3)
–0.3 to (+VA + 0.3)
–0.3 to (+VCC + 0.3)
–40 to 85
V
V
V
V
°C
°C
°C
–65 to 150
Junction temperature (TJmax)
150
Power dissipation
(TJ Max–TA)/ θJA
86
QFN package
θJA Thermal impedance
Vapor phase (60 sec)
Infrared (15 sec)
°C/W
°C
215
Lead temperature, soldering
220
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Copyright © 2009, Texas Instruments Incorporated
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