ADS131M04-Q1
ZHCSOL7A –MARCH 2022 –REVISED AUGUST 2022
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6.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
MIN
NOM
MAX UNIT
POWER SUPPLY
AVDD to AGND, normal operating modes
2.7
2.4
3.0
3.0
3.6
AVDD to AGND, standby and current-detect
3.6
Analog power supply
modes
V
V
AGND to DGND
DVDD to DGND
0
0.3
3.6
–0.3
2.7
3.0
Digital power supply
DVDD to DGND, DVDD shorted to CAP
(digital LDO bypassed)
1.65
1.8
2
ANALOG INPUTS(1)
AGND –
Gain = 1, 2, or 4
AVDD
AVDD –1.8
VREF / Gain
1.3
VAINxP
VAINxN
,
Absolute input voltage
V
V
AGND –
Gain = 8, 16, 32, 64 or 128
VIN = VAINxP - VAINxN
1.3
–VREF
/
VIN
Differential input voltage
Gain
EXTERNAL CLOCK SOURCE
High-resolution mode
Low-power mode
0.3
0.3
8.192
4.096
2.048
50%
8.4
fCLKIN
External clock frequency
4.15 MHz
2.08
Very-low-power mode
0.3
Duty cycle
40%
60%
DIGITAL INPUTS
Input voltage
TEMPERATURE RANGE
TA Operating ambient temperature
DGND
DVDD
V
125
°C
–40
(1) The subscript "x" signifies the channel. For example, the positive analog input to channel 0 is named AIN0P. See the Pin Configuration
and Functions section for the pin names.
6.4 Thermal Information
ADS131M04-Q1
THERMAL METRIC(1)
PW (TSSOP)
20 PINS
94.9
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
Rθ
Junction-to-case (top) thermal resistance
34.9
JC(top)
RθJB
ΨJT
Junction-to-board thermal resistance
46.4
2.7
°C/W
°C/W
°C/W
Junction-to-top characterization parameter
Junction-to-board characterization parameter
46.0
ΨJB
Rθ
Junction-to-case (bottom) thermal resistance
N/A
°C/W
JC(bot)
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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