73M2901CE Data Sheet
DS_2901CE_031
Revision History
Revision Date
Description
2.2.1
3.1
4/20/2004
First publication.
12/14/2007 Replaced 32QFN punched with SAWN package, removed leaded package
option, updated schematic and minor clean up.
3.2
3.3
1/21/2008
Changed dimension of bottom exposed pad on 32QFN mechanical package
figure.
4/3/2009
Formatted to new Teridian style.
Assigned new document number.
Minor corrections have been made to Section 5.3 and Section 6.3.
© 2009 Teridian Semiconductor Corporation. All rights reserved.
Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation.
Simplifying System Integration is a trademark of Teridian Semiconductor Corporation.
All other trademarks are the property of their respective owners.
Teridian Semiconductor Corporation makes no warranty for the use of its products, other than expressly
contained in the Company’s warranty detailed in the Teridian Semiconductor Corporation standard Terms
and Conditions. The company assumes no responsibility for any errors which may appear in this
document, reserves the right to change devices or specifications detailed herein at any time without
notice and does not make any commitment to update the information contained herein. Accordingly, the
reader is cautioned to verify that this document is current by comparing it to the latest version on
http://www.teridian.com or by checking with your sales representative.
Teridian Semiconductor Corp., 6440 Oak Canyon, Suite 100, Irvine, CA 92618
TEL (714) 508-8800, FAX (714) 508-8877, http://www.teridian.com
22
Rev. 3.3
TERIDIAN [ TERIDIAN SEMICONDUCTOR CORPORATION ]
