Case T
Symbol
Inches
Millimeters
Notes
Min
Max
.125
.019
.009
.830
.420
.450
---
Min
Max
3.18
0.48
0.23
21.08
A
.097
.015
.003
---
2.46
0.38
0.08
---
b
5
5
3
c
D
E
.400
---
10.16 10.67
E1
E2
E3
e
---
11.43
---
3
.180
.030
4.57
0.76
---
---
9
.050 BSC
1.27 BSC
4,6
L
.250
.026
---
.370
.045
.045
---
6.35
0.66
---
9.40
1.14
1.14
---
Q
S
7
S1
S2
.000
---
0.00
---
7,8
---
---
---
---
---
---
N
32
6
NOTES:
1. Index area; a notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the
shaded area shown. The manufacturer's identification shall not be used as a pin one identification mark. Alternatively,
a tab (dim. k) may be used to identify pin one. This tab may be located in the shaded area on either side of the terminal
as shown in detail G, or it may be located in the shaded area as shown in detail H.
2. Dimension Q shall be measured at the point of exit of the lead from the body. Dimension Q minimum shall be reduced
by .0015 inch (0.038 mm) maximum when lead finish A is applied.
3. This dimension allows for off-center lid, meniscus, and glass overrun.
4. The basic lead spacing is .050 (1.27 mm) between centerlines. Each lead centerline shall be located within .005 (0.13
mm) of its exact longitudinal position relative to lead 1 and the highest numbered (N) lead.
5. All leads - Increase maximum limit by .003 (0.08 mm) measured at the center of the flat, when lead finish A or B is
applied.
6. Total number of spaces = (N-2). Symbol "N" is the maximum number of leads.
7. Measure all four corner leads.
8. Dimension S1 (see 5.2.2 of MIL-STD-1835) may be .000 (0.00 mm) if the corner leads, upon entering the body of the
package, and within one lead's width, bend toward the die cavity. See 5.2.2 of MIL-STD-1835 for measurement of S1
on bottom-brazed flat packs.
9. Bottom brazed lead configuration. If this configuration is used, no organic or polymeric materials shall be molded to the
bottom of the package to cover the leads.
10. Dimensions are in inches.
11. Metric equivalents are given for general information only.
12. Case outline configurations 3 and 4 and all bottom-brazed outlines with a "Q" dimension less than .026 inch (0.66 mm)
minimum, but not less than .010 inch (.025 mm) minimum, are acceptable only for use in equipment designed or
redesigned on or before 29 November 1986.
13.
FIGURE 1. Case outlines – Continued.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
24
DSCC FORM 2234
APR 97
TEMIC [ TEMIC SEMICONDUCTORS ]
