Case 8
Symbol
Inches
Max
.500 11.68 12.70
.040 0.51 1.02
Millimeters
Notes
3
Min
Min Max
A
.460
.020
.440
.565
.016
.008
A1
A2
A3
B
.460 11.18 11.68
.645 14.35 16.38
.020
.012
0.41
0.20
0.51
0.30
C
D
1.630 1.670 41.40 42.42
.090 .130 2.29 3.30
.050 BSC 1.27 BSC
.100 BSC 2.54 BSC
6
1
E
e1
eA
L
.125
.155
.105
3.18
3.95
2.67
M
N
.055
1.40
32
S
.030
.070
0.76
1.78
NOTES:
1. N is the number of leads.
2. The chamfer on the body is optional. If is not present, a visual index feature must be located within the cross hatched
area.
3. Lead configuration in this area is optional.
4. Controlling dimension: Inches.
5. Solder finish is optional. However, if leads are solder dipped or plated, increase maximum limit of all leads by 0.003"
from center of flat.
6. The cover shall not extend beyond the edges of the ceramic body.
FIGURE 1. Case outlines - Continued.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
28
DSCC FORM 2234
APR 97
TEMIC [ TEMIC SEMICONDUCTORS ]
