Case U – Continued.
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only.
3. All dimensions and tolerances conform to ANSI Y14.5M-1982.
4. Metallized castellations shall be connected to plane 1 terminals.
5. Index area: A pin identification mark shall be located adjacent to pin one within the shaded area shown.
Plane 1 terminal identification may be an extension of the length of the metallized terminal which shall not be
wider than the b dimension.
6. The cover shall not extend beyond the edges of the body.
7. The corner shape (square, notch, radius, etc.) may vary at the manufacturer's option.
8. N indicates the number of terminals.
9. Unless otherwise specified, a minimum clearance of .015 inch (.381 mm) shall be maintained between all
metallized features (e.g., lid, castellation, terminals, thermal pads, etc.).
10. Solder finish is optional with a maximum allowable thickness of .007 inch. Measurement of dimensions A, b1,
and L2 may be made prior to solder application.
FIGURE 1. Case outlines – Continued.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
23
DSCC FORM 2234
APR 97
TEMIC [ TEMIC SEMICONDUCTORS ]
