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5962-8956805VUA 参数 Datasheet PDF下载

5962-8956805VUA图片预览
型号: 5962-8956805VUA
PDF下载: 下载PDF文件 查看货源
内容描述: [FIFO, 4KX9, 40ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28]
分类和应用: 先进先出芯片
文件页数/大小: 35 页 / 209 K
品牌: TEMIC [ TEMIC SEMICONDUCTORS ]
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3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be  
marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space  
limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the  
RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.  
Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.  
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required  
in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.  
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535  
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of  
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see  
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this  
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535  
and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.  
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or  
for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.  
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2  
herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.  
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain  
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made  
available onshore at the option of the reviewer.  
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in  
microcircuit group number 41 (see MIL-PRF-38535, appendix A).  
4. QUALITY ASSURANCE PROVISIONS  
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with  
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan  
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be  
in accordance with MIL-PRF-38535, appendix A.  
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted  
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in  
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.  
4.2.1 Additional criteria for device class M.  
a. Delete the sequence specified as initial (preburn-in) electrical parameters through interim (postburn-in) electrical  
parameters of method 5004 and substitute lines 1 through 6 of table IIA herein.  
b. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made  
available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and  
power dissipation, as applicable, in accordance with the intent specified in test method 1015.  
(1) Dynamic burn-in (method 1015 of MIL-STD-883, test condition C or D; for circuit, see 4.2.1b herein).  
c. Interim and final electrical parameters shall be as specified in table IIA herein.  
SIZE  
STANDARD  
5962-89568  
MICROCIRCUIT DRAWING  
A
REVISION LEVEL  
H
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
5
DSCC FORM 2234  
APR 97  
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