HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of the DODISS
cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the issues of the
documents cited in the solicitation.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM Standard F1192M-95
-
Standard Guide for the Measurement of Single Event Phenomena from
Heavy Ion Irradiation of Semiconductor Devices.
(Applications for copies of ASTM publications should be addressed to the American Society for Testing and Materials,
1916 Race Street, Philadelphia, PA 19103).
ELECTRONICS INDUSTRIES ASSOCIATION (EIA)
JEDEC Standard EIA/JESD78
-
IC Latch-Up Test.
(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington, VA
22201.)
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute
the documents. These documents also may be available in or through libraries or other informational services.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless
a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-
38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in
the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M
shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
SIZE
STANDARD
5962-89568
MICROCIRCUIT DRAWING
A
REVISION LEVEL
H
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
4
DSCC FORM 2234
APR 97
TEMIC [ TEMIC SEMICONDUCTORS ]
