SILICON PIN DIODES
Non m agnetic square ceram ic package 500 volts PIN diodes
NON MAGNETIC S QUARE CERAMIC PACKAGE
5 0 0 VOLTS P IN DIODES
Features
Description
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Non m agnetic package
TEMEX is m anufacturing a non m agnetic
square PIN diode for surface m ount appli-
cations. The properties of non m agnetism
prevent interference in the m agnetic field of the
im aging system .The chip inside is passivated to
ensure high reliability and very low leakage.
These diodes ensure high power switching at
frequencies from 1 MHz to several GHz. This
package utilizes ceram ic package technology
with low inductance and axial term inations.The
design sim plifies autom atic pick and place
indexing and assem bly. The term ination
contacts are tin plated for vapor or reflow circuit
board soldering. The active area is a PIN high
power glass passivated chip which can be
designed to custom er specifications.
Low loss, low distortion
Low inductance
High reliability
Herm etically sealed package
Glass passivated PIN diode chip
Non rolling MELF design
Pick and place com patibility
Pinning
Outline draw ing
SOLDERABLE
SURFACES
CERAMIC
0.635 max
(.025 max)
+0.3
-0.3
3.20
(.126+-..001122
)
CHIP
FULL FACE BOND
12-15
Vol. 1
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