TSL2571
LIGHT-TO-DIGITAL CONVERTER
TAOS117A − FEBRUARY 2011
MANUFACTURING INFORMATION
The FN package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
Table 13. Solder Reflow Profile
PARAMETER
Average temperature gradient in preheating
Soak time
REFERENCE
DEVICE
2.5°C/sec
t
2 to 3 minutes
Max 60 sec
Max 50 sec
Max 10 sec
260°C
soak
Time above 217°C (T1)
t
1
Time above 230°C (T2)
t
2
Time above T
−10°C (T3)
t
peak
3
Peak temperature in reflow
T
peak
Temperature gradient in cooling
Max −5°C/sec
Not to scale — for reference only
T
peak
T
3
T
T
2
1
Time (sec)
t
t
t
3
2
1
t
soak
Figure 14. Solder Reflow Profile Graph
Copyright E 2011, TAOS Inc.
The LUMENOLOGY r Company
r
r
22
www.taosinc.com
TAOS [ TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS ]
