TSL2571
LIGHT-TO-DIGITAL CONVERTER
TAOS117A − FEBRUARY 2011
MECHANICAL DATA
PACKAGE FN
Dual Flat No-Lead
TOP VIEW
466 ꢂ 10
PIN OUT
TOP VIEW
PIN 1
VDD
1
SCL 2
GND 3
6 SDA
5 INT
4 NC
466
ꢂ 10
2000 ꢂ 100
2000
ꢂ 100
Photodiode Array Area
END VIEW
SIDE VIEW
295
Nominal
650 ꢂ 50
203 ꢂ 8
650
300
ꢂ 50
BOTTOM VIEW
C of Photodiode Array Area
C
L of Solder Contacts
L(Note B)
20 Nominal
140 Nominal
C
L of Solder Contacts
of Photodiode Array Area (Note B)
C
L
PIN 1
Pb
750 ꢂ 150
Lead Free
NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is 20 μm unless otherwise noted.
B. The die is centered within the package within a tolerance of 3 mils.
C. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
E. This package contains no lead (Pb).
F. This drawing is subject to change without notice.
Figure 12. Package FN — Dual Flat No-Lead Packaging Configuration
Copyright E 2011, TAOS Inc.
The LUMENOLOGY r Company
r
r
20
www.taosinc.com
TAOS [ TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS ]
