TCS3404, TCS3414
DIGITAL COLOR SENSORS
TAOS137A − APRIL 2011
MANUFACTURING INFORMATION
Moisture Sensitivity
Optical characteristics of the device can be adversely affected during the soldering process by the release and
vaporization of moisture that has been previously absorbed into the package molding compound. To ensure the
package molding compound contains the smallest amount of absorbed moisture possible, each device is
dry-baked prior to being packed for shipping. Devices are packed in a sealed aluminized envelope with silica
gel to protect them from ambient moisture during shipping, handling, and storage before use.
CS Package
The CS package has been assigned a moisture sensitivity level of MSL 2 and the devices should be stored under
the following conditions:
Temperature Range
Relative Humidity
Floor Life
5°C to 50°C
60% maximum
1 year out of bag at ambient < 30°C / 60% RH
Rebaking will be required if the aluminized envelope has been open for more than 1 year. If rebaking is required,
it should be done at 50°C for 12 hours.
FN Package
The FN package has been assigned a moisture sensitivity level of MSL 3 and the devices should be stored under
the following conditions:
Temperature Range
Relative Humidity
Total Time
5°C to 50°C
60% maximum
12 months from the date code on the aluminized envelope — if unopened
168 hours or fewer
Opened Time
Rebaking will be required if the devices have been stored unopened for more than 12 months or if the aluminized
envelope has been open for more than 168 hours. If rebaking is required, it should be done at 50°C for 12 hours.
Copyright E 2011, TAOS Inc.
The LUMENOLOGY r Company
r
r
www.taosinc.com
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TAOS [ TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS ]
