TCS3404, TCS3414
DIGITAL COLOR SENSORS
TAOS137A − APRIL 2011
MECHANICAL DATA
PACKAGE CS
Six-Lead Chipscale
TOP VIEW
PINOUT
TOP VIEW
2095
SCL SYNC GND
A1
A2
A3
1565
ꢃ 10
1875
B1
B2
B3
SDA
V
INT
DD
350
ꢃ 10
PHOTODIODE ARRAY
END VIEW
405 ꢃ 20
685 ꢃ 45
6
ꢁ 160 ꢃ 30
BOTTOM VIEW
C
L of Photodiode
of Solder Bumps
C
L
Array Area
128 Nominal
6
ꢁ ꢂ 300 ꢃ 30
463 ꢃ 30
950
Nominal
of Solder Bumps and
C
L Photodiode Array Area
Pb
Lead Free
610 Nominal
438 ꢃ 30
NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is 25 μm unless otherwise noted.
B. Solder bumps are formed of Sn (96.5%), Ag (3%), and Cu (0.5%).
C. The layer above the photodiode is glass and epoxy with an index of refraction of 1.53.
D. This drawing is subject to change without notice.
Figure 31. Package CS — Six-Lead Chipscale Packaging Configuration
Copyright E 2011, TAOS Inc.
The LUMENOLOGY r Company
r
r
34
www.taosinc.com
TAOS [ TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS ]
