TCS3404, TCS3414
DIGITAL COLOR SENSORS
TAOS137A − APRIL 2011
MANUFACTURING INFORMATION
The CS and FN packages have been tested and has demonstrated an ability to be reflow soldered to a PCB
substrate.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
Table 12. Solder Reflow Profile
PARAMETER
Average temperature gradient in preheating
REFERENCE
TCS3404/14
2.5°C/sec
Soak time
t
2 to 3 minutes
Max 60 sec
soak
Time above 217°C (T1)
Time above 230°C (T2)
t
1
t
Max 50 sec
2
Time above T
−10°C (T3)
t
Max 10 sec
peak
3
Peak temperature in reflow
T
260° C (−0°C/+5°C)
Max −5°C/sec
peak
Temperature gradient in cooling
Not to scale — for reference only
T
peak
T
3
T
T
2
1
Time (sec)
t
t
t
3
2
1
t
soak
Figure 35. Solder Reflow Profile Graph
Copyright E 2011, TAOS Inc.
The LUMENOLOGY r Company
r
r
38
www.taosinc.com
TAOS [ TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS ]
