TAS2521
SLAS687A –FEBRUARY 2013–REVISED FEBRUARY 2013
www.ti.com
Table 2-1. RGE PIN FUNCTIONS (continued)
PIN
I/O(1)
DESCRIPTION
NAME
NO.
17
18
19
20
21
22
23
24
MISO
O
SPI Serial Data Output
GPIO/DOUT
SCL/SSZ
SDA/MOSI
SCLK
I/O/Z GPIO / Audio Serial Bus Output
I
I
I
Either I2C Input Serial Clock or SPI Chip Select Signal depending on SPI_SEL state
Either I2C Serial Data Input or SPI Serial Data Input depending on SPI_SEL state.
Serial clock for SPI interface
IOVDD
PWR I/O Power Supply, 1.1V - 3.6V
PWR Digital Power Supply, 1.65V - 1.95V
GND Digital Ground, 0V
DVDD
DVSS
3 ELECTRICAL SPECIFICATIONS
3.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
MIN
–0.3
MAX
2.2
2.2
6
AVDD to AVSS
V
V
DVDD to DVSS
–0.3
SPKVDD to SPKVSS
IOVDD to IOVSS
–0.3
V
–0.3
3.9
V
Digital input voltage
IOVSS – 0.3
AVSS – 0.3
–40
IOVDD + 0.3
V
Analog input voltage
Operating temperature range
Storage temperature range
Junction temperature (TJ Max)
AVDD + 0.3
V
85
°C
°C
°C
W
–55
150
105
QFN
Power dissipation(with thermal pad soldered to board)
(TJ Max – TA) / θJA
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
3.2 THERMAL INFORMATION
TAS2521
THERMAL METRIC(1)
UNITS
RGE (24 PINS)
θJA
Junction-to-ambient thermal resistance
32.2
30.0
9.2
θJCtop
θJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.3
ψJB
9.2
θJCbot
2.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953
4
ELECTRICAL SPECIFICATIONS
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