■ PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
1. Circuit Design
◆Verification of operating environment, electrical rating and performance
1.A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general pur-
pose applications.
◆Operating Voltage（Verification of Rated voltage）
1.The operating voltage for capacitors must always be their rated voltage or less.
Precautions
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2.Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage
having rapid rise time is used in a circuit.
2. PCB Design
◆Pattern configurations（Design of Land-patterns）
1. When capacitors are mounted on PCBs, the amount of solder used（size of fillet）can directly affect the capacitor performance. Therefore, the following items must
be carefully considered in the design of land patterns:
（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper
amount of solder.
Precautions
（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist.
◆Pattern configuration（s Capacitor layout on PCBs）
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes（PCB cutting, board inspection,
mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land pattern configurations and positions of capacitors
shall be carefully considered to minimize stresses.
◆Pattern configurations（Design of Land-patterns）
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
（1）Recommended land dimensions for typical chip capacitors
●Multilayer Ceramic Capacitors : Recommended land dimensions（unit: mm）
ꢁWave-soldering
Land patterns for PCBs
Chip capacitor
Land
Type 107
212
2.0
316
3.2
1.6
325
3.2
2.5
L
1.6
0.8
Solder-resist
Size
W
51.25
A
0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5
0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7
0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5
C
B
C
B
B
A
Reflow-soldering
Type 042
063
0.6
0.3
105
1.0
0.5
107
1.6
0.8
212
2.0
316
3.2
1.6
325
3.2
2.5
432
4.5
3.2
Chip capacitor
L
0.4
0.2
Size
W
51.25
W
A
0.15 to 0.25 0.20 to 0.30 0.45 to 0.55 0.8 to 1.0 0.8 to 1.2 1.8 to 2.5 1.8 to 2.5 2.5 to 3.5
0.15 to 0.20 0.20 to 0.30 0.40 to 0.50 0.6 to 0.8 0.8 to 1.2 1.0 to 1.5 1.0 to 1.5 1.5 to 1.8
0.15 to 0.30 0.25 to 0.40 0.45 to 0.55 0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 1.8 to 3.2 2.3 to 3.5
B
C
L
Note：Recommended land size might be different according to the allowance of the size of the product.
LWDC
●LWDC: Recommended land dimensions for reflow-soldering（unit: mm）
Type
105
0.52
107
50.8
212
1.25
L
W
Size
W
1.0
1.6
2.0
A
0.18 to 0.22
0.2 to 0.25
0.9 to 1.1
0.25 to 0.3
0.3 to 0.4
1.5 to 1.7
0.5 to 0.7
0.4 to 0.5
1.9 to 2.1
B
C
L
Technical
consider-
ations
●Array type: Recommended land dimensions for reflow-soldering（unit: mm）
Type 096（2 circuits）110（2 circuits）212（2 circuits） 212（4 circuits）
2 circuits
4 circuits
Chip capacitor
L
0.9
1.37
2.0
2.0
c
c
Size
W
0.6
1.0
1.25
1.25
a
b
a
a
b
a
a
0.25 to 0.35
0.15 to 0.25
0.15 to 0.25
0.45
0.35 to 0.45
0.55 to 0.65
0.3 to 0.4
0.64
0.5 to 0.6
0.5 to 0.6
0.5 to 0.6
1.0
0.5 to 0.6
0.5 to 0.6
0.2 to 0.3
0.5
b
c
d
d
d
Land
（2）Examples of good and bad solder application
Items
Not recommended
Recommended
Mixed mounting of
SMD and leaded
components
Component
placement close to
the chassis
Hand-soldering
of leaded
components
near mounted
components
Horizontal
component
placement
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＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
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TAIYO YUDEN [ TAIYO YUDEN (U.S.A.), INC ]
