TEA2025B - TEA2025D
Stability
- No sockets.
2) the heatsinkcan have a smaller factor of safety
compared with that of a conventional circuit.
There is no device damage in the case of ex-
cessive junction temperature: all that happens
is that PO (and therefore Ptot) and Id are re-
duced.
A good layout is recommended in order to avoid
oscillations.
Generally the designer must pay attention on the
following points:
- Short wires of componentsand short connec-
tions.
APPLICATION SUGGESTION
- No ground loops.
The recommended values of the components are
those shown on stereo application circuit of
Fig. 2 different values can be used, the follow-
ing table can help the designer.
- Bypass of supply voltage with capacitors as
nearest as possible to the supply I.C.pin.The
low value(poliester)capacitors must have
good temperatureand frequency charac-
teristics.
RECOMMENDED
COMPONENT
PURPOSE
LARGER THAN
SMALLER THAN
VALUE
C1,C2
0.22µF
INPUT
DECOUPLING
DC
IN
CASE OF SLIDER
CONTACT NOISE OF
VARIABLE
RESISTOR
C3
100µF
DEGRADATION OF
SVR, INCREASE OF
RIPPLE REJECTON
THD
FREQUENCY
AT
LOW
AND
LOW VOLTAGE
C4,C5
C6,C7
100µF
470µF
BOOTSTRAP
INCREASE OF LOW
FREQUENCY CUT-
OFF
OUTPUT
DECOUPLING
DC
C8,C9
0.15µF
100µF
FREQUENCY
STABILITY
DANGER
OSCILLATIONS
OF
C10, C11
INCREASE OF LOW
FREQUENCY CUT-
OFF
INVERTING
DC DECOUPLING
INPUT
6/9
STMICROELECTRONICS [ ST ]
