Packaging information
BTA12, BTB12, T12xx
3
Packaging information
●
Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
2
Table 8.
D PAK dimensions
Dimensions
Millimeters
Min. Typ. Max. Min. Typ. Max.
Ref.
Inches
A
4.30
4.60 0.169
2.69 0.098
0.23 0.001
0.93 0.027
0.181
0.106
0.009
0.037
A
A1 2.49
A2 0.03
E
C2
L2
B
0.70
B2 1.25 1.40
0.45
C2 1.21
D
0.048 0.055
L
C
0.60 0.017
1.36 0.047
9.35 0.352
10.28 0.393
5.28 0.192
15.85 0.590
1.40 0.050
1.75 0.055
0.024
0.054
0.368
0.405
0.208
0.624
0.055
0.069
L3
A1
B2
B
R
C
D
E
G
L
8.95
10.00
4.88
G
A2
2mm min.
FLAT ZONE
15.00
L2 1.27
L3 1.40
R
V2
0.40
0.016
V2
0°
8°
0°
8°
Figure 15. Footprint (dimensions in mm)
16.90
10.30
5.08
1.30
3.70
8.90
8/12
STMICROELECTRONICS [ ST ]
