STM8S903K3 STM8S903F3
List of figures
Figure 48. Recommended footprint for on-board emulation ..................................................................97
Figure 49. Recommended footprint without on-board emulation ...........................................................98
Figure 50. 32-lead shrink plastic DIP (400 ml) package ........................................................................98
Figure 51. 20-pin, 4.40 mm body, 0.65 mm pitch .................................................................................101
Figure 52. 20-lead, plastic small outline (300 mils) package ...............................................................101
Figure 53. STM8S903K3/F3 ordering information scheme ..................................................................104
DocID15590 Rev 8
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