Electrical characteristics
Table 9.
Thermal characteristics
STM32F103xC, STM32F103xD, STM32F103xE
Symbol
T
STG
T
J
Ratings
Storage temperature range
Maximum junction temperature
Value
–65 to +150
150
Unit
°C
°C
5.3
5.3.1
Operating conditions
General operating conditions
Table 10.
Symbol
f
HCLK
f
PCLK1
f
PCLK2
V
DD
General operating conditions
Parameter
Internal AHB clock frequency
Internal APB1 clock frequency
Internal APB2 clock frequency
Standard operating voltage
Analog operating voltage
(ADC not used)
Analog operating voltage
(ADC used)
Backup operating voltage
LQFP144
Power dissipation at T
A
=
85 °C for suffix 6 or T
A
=
105 °C for suffix 7
(3)
LQFP100
LQFP64
LFBGA100
LFBGA144
Ambient temperature for 6
suffix version
Maximum power dissipation
Low power dissipation
(4)
Maximum power dissipation
Low power dissipation
(4)
6 suffix version
–40
–40
–40
–40
–40
–40
Conditions
Min
0
0
0
2
2
Must be the same potential
as V
DD(2)
2.4
1.8
Max
72
36
72
3.6
3.6
V
3.6
3.6
666
434
444
500
500
85
°C
105
105
°C
125
105
°C
7 suffix version
125
mW
V
V
MHz
Unit
V
DDA(1)
V
BAT
P
D
T
A
Ambient temperature for 7
suffix version
T
J
Junction temperature range
1. When the ADC is used, refer to
2. It is recommended to power V
DD
and V
DDA
from the same source. A maximum difference of 300 mV
between V
DD
and V
DDA
can be tolerated during power-up and operation.
3. If T
A
is lower, higher P
D
values are allowed as long as T
J
does not exceed T
J
max (see
4. In low power dissipation state, T
A
can be extended to this range as long as T
J
does not exceed T
J
max (see
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