STM32F103xC, STM32F103xD, STM32F103xE
Package characteristics
Figure 63. LQFP144, 20 x 20 mm, 144-pin low-profile quad
flat package outline
(1)
Seating plane
C
Figure 64. Recommended
footprint
(1)(2)
A
A2 A1
ccc
C
b
c
0.25 mm
gage plane
D
D1
D3
A1
73
72
0.5
109
108
73
1.35
0.35
72
k
L
L1
19.9
17.85
22.6
108
109
144
37
E1
E3
E
1
19.9
22.6
36
ai149
144
37
1
36
Pin 1
identification
e
ME_1A
1. Drawing is not to scale.
2. Dimensions are in millimeters.
Table 67.
Symbol
LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package mechanical data
millimeters
Min
Typ
Max
1.60
0.05
1.35
0.17
0.09
21.80
19.80
22.00
20.00
17.50
21.80
19.80
22.00
20.00
17.50
0.50
0.45
0.60
1.00
0°
3.5°
0.08
7°
0°
0.75
0.0177
22.20
20.20
0.8583
0.7795
1.40
0.22
0.15
1.45
0.27
0.20
22.20
20.20
0.002
0.0531
0.0067
0.0035
0.8583
0.7795
0.8661
0.7874
0.689
0.8661
0.7874
0.689
0.0197
0.0236
0.0394
3.5°
0.0031
7°
0.0295
0.874
0.7953
0.0551
0.0087
Min
inches
(1)
Typ
Max
0.063
0.0059
0.0571
0.0106
0.0079
0.874
0.7953
A
A1
A2
b
c
D
D1
D3
E
E1
E3
e
L
L1
k
ccc
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Doc ID 14611 Rev 7
111/123
STMICROELECTRONICS [ STMICROELECTRONICS ]
