Package characteristics
STM32F103xC, STM32F103xD, STM32F103xE
6.2
Thermal characteristics
The maximum chip junction temperature (T
J
max) must never exceed the values given in
The maximum chip-junction temperature, T
J
max, in degrees Celsius, may be calculated
using the following equation:
T
J
max = T
A
max + (P
D
max x
JA
)
Where:
●
●
●
●
T
A
max is the maximum ambient temperature in °C,
JA
is the package junction-to-ambient thermal resistance, in
C/W,
P
D
max is the sum of P
INT
max and P
I/O
max (P
D
max = P
INT
max + P
I/O
max),
P
INT
max is the product of I
DD
and V
DD
, expressed in Watts. This is the maximum chip
internal power.
P
I/O
max =
(V
OL
× I
OL
) +
((V
DD
– V
OH
) × I
OH
),
P
I/O
max represents the maximum power dissipation on output pins where:
taking into account the actual V
OL
/ I
OL
and V
OH
/ I
OH
of the I/Os at low and high level in the
application.
Table 70.
Symbol
Package thermal characteristics
Parameter
Thermal resistance junction-ambient
LFBGA144 - 10 × 10 mm / 0.8 mm pitch
Thermal resistance junction-ambient
LQFP144 - 20 × 20 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LFBGA100 - 10 × 10 mm / 0.8 mm pitch
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
WLCSP64
Value
40
30
40
°C/W
46
45
50
Unit
JA
6.2.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
114/123
Doc ID 14611 Rev 7
STMICROELECTRONICS [ STMICROELECTRONICS ]
