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STM32F103RCY7XXX 参数 Datasheet PDF下载

STM32F103RCY7XXX图片预览
型号: STM32F103RCY7XXX
PDF下载: 下载PDF文件 查看货源
内容描述: 高密度高性能线的基于ARM的32位MCU,具有256至512KB闪存, USB , CAN ,11个定时器, 3的ADC ,13个通信接口 [High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces]
分类和应用: 闪存通信
文件页数/大小: 123 页 / 1691 K
品牌: STMICROELECTRONICS [ STMICROELECTRONICS ]
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STM32F103xC, STM32F103xD, STM32F103xE
Package characteristics
Figure 59. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package outline
C
Seating
plane
A2
A4
A3
B
D
D1
e
M
F
F
A
A
A1
ddd
C
E1 E
e
Øb (144
balls)
Ball A1
Ø eee M C A
Ø fff M
C
B
X3_ME
1. Drawing is not to scale.
Table 64.
LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package data
millimeters
inches
(1)
Max
1.70
0.21
1.07
0.27
0.85
0.35
9.85
0.40
10.00
8.80
9.85
10.00
8.80
0.80
0.60
0.10
0.15
0.08
10.15
0.3878
0.45
10.15
0.0138
0.3878
0.0157
0.3937
0.3465
0.3937
0.3465
0.0315
0.0236
0.0039
0.0059
0.0031
0.3996
0.0083
0.0421
0.0106
0.0335
0.0177
0.3996
Typ
Min
Max
0.0669
Symbol
Min
A
A1
A2
A3
A4
b
D
D1
E
E1
e
F
ddd
eee
fff
Typ
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Doc ID 14611 Rev 7
107/123