欢迎访问ic37.com |
会员登录 免费注册
发布采购

STM32F103R4T6XXX 参数 Datasheet PDF下载

STM32F103R4T6XXX图片预览
型号: STM32F103R4T6XXX
PDF下载: 下载PDF文件 查看货源
内容描述: 基于ARM的低密度高性能线的32位MCU,具有16或32 KB闪存, USB , CAN ,6个定时器, 2的ADC ,6个通信接口 [Low-density performance line, ARM-based 32-bit MCU with 16 or 32 KB Flash, USB, CAN, 6 timers, 2 ADCs, 6 communication interfaces]
分类和应用: 闪存通信
文件页数/大小: 80 页 / 1067 K
品牌: STMICROELECTRONICS [ ST ]
 浏览型号STM32F103R4T6XXX的Datasheet PDF文件第68页浏览型号STM32F103R4T6XXX的Datasheet PDF文件第69页浏览型号STM32F103R4T6XXX的Datasheet PDF文件第70页浏览型号STM32F103R4T6XXX的Datasheet PDF文件第71页浏览型号STM32F103R4T6XXX的Datasheet PDF文件第73页浏览型号STM32F103R4T6XXX的Datasheet PDF文件第74页浏览型号STM32F103R4T6XXX的Datasheet PDF文件第75页浏览型号STM32F103R4T6XXX的Datasheet PDF文件第76页  
Package characteristics  
STM32F103x4, STM32F103x6  
Figure 38. Recommended PCB design rules for pads (0.5 mm pitch BGA)  
0.5 mm  
Pitch  
D pad  
0.27 mm  
0.35 mm typ (depends on  
the soldermask registration  
tolerance)  
Dsm  
Solder paste  
0.27 mm aperture diameter  
Dpad  
Dsm  
ai15495  
1. Non solder mask defined (NSMD) pads are recommended  
2. 4 to 6 mils solder paste screen printing process  
72/80  
Doc ID 15060 Rev 3  
 复制成功!