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STM32F103R4T6XXX 参数 Datasheet PDF下载

STM32F103R4T6XXX图片预览
型号: STM32F103R4T6XXX
PDF下载: 下载PDF文件 查看货源
内容描述: 基于ARM的低密度高性能线的32位MCU,具有16或32 KB闪存, USB , CAN ,6个定时器, 2的ADC ,6个通信接口 [Low-density performance line, ARM-based 32-bit MCU with 16 or 32 KB Flash, USB, CAN, 6 timers, 2 ADCs, 6 communication interfaces]
分类和应用: 闪存通信
文件页数/大小: 80 页 / 1067 K
品牌: STMICROELECTRONICS [ ST ]
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STM32F103x4, STM32F103x6  
Package characteristics  
Figure 37. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package outline  
B
D
D1  
A
A
e
F
A1  
H
G
F
F
E
D
C
B
A
E1  
E
e
1
2
3
4
5
6
7
8
Øb (64 balls)  
A1 ball pad corner  
A3  
A4  
A2  
Seating  
plane  
C
Bottom view  
ME_R8  
1. Drawing is not to scale.  
Table 52. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package  
mechanical data  
millimeters  
Typ  
inches(1)  
Symbol  
Min  
Max  
Min  
Typ  
Max  
A
1.200  
0.0472  
A1  
A2  
A3  
A4  
b
0.150  
0.0059  
0.785  
0.200  
0.0309  
0.0079  
0.600  
0.350  
5.150  
0.0236  
0.0138  
0.2028  
0.250  
4.850  
0.300  
5.000  
3.500  
5.000  
3.500  
0.500  
0.750  
0.080  
0.150  
0.050  
0.0098  
0.1909  
0.0118  
0.1969  
0.1378  
0.1969  
0.1378  
0.0197  
0.0295  
0.0031  
0.0059  
0.0020  
D
D1  
E
4.850  
5.150  
0.1909  
0.2028  
E1  
e
F
ddd  
eee  
fff  
1. Values in inches are converted from mm and rounded to 4 decimal digits.  
Doc ID 15060 Rev 3  
71/80  
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