Package characteristics
STM32F103x4, STM32F103x6
Figure 35. LQFP64, 10 x 10 mm, 64-pin low-profile quad
Figure 36. Recommended
(1)
(1)(2)
flat package outline
footprint
A
A2
48
33
A1
0.3
49
32
0.5
b
E
E1
12.7
10.3
10.3
e
64
17
1.2
1
16
7.8
D1
D
c
12.7
L1
ai14909
L
ai14398b
1. Drawing is not to scale.
2. Dimensions are in millimeters.
Table 51. LQFP64, 10 x 10 mm, 64-pin low-profile quad flat package mechanical data
millimeters
Typ
inches(1)
Symbol
Min
Max
Min
Typ
Max
A
A1
A2
b
1.60
0.15
1.45
0.27
0.20
0.0630
0.0059
0.0571
0.0106
0.0079
0.05
1.35
0.17
0.09
0.0020
0.0531
0.0067
0.0035
1.40
0.22
0.0551
0.0087
c
D
12.00
10.00
12.00
10.00
0.50
0.4724
0.3937
0.4724
0.3937
0.0197
3.5°
D1
E
E1
e
0°
3.5°
7°
0°
7°
L
0.45
0.60
0.75
0.0177
0.0236
0.0394
0.0295
L1
1.00
Number of pins
64
1. Values in inches are converted from mm and rounded to 4 decimal digits.
N
70/80
Doc ID 15060 Rev 3
STMICROELECTRONICS [ ST ]
