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STM32F103RET6TR 参数 Datasheet PDF下载

STM32F103RET6TR图片预览
型号: STM32F103RET6TR
PDF下载: 下载PDF文件 查看货源
内容描述: 高密度高性能线的基于ARM的32位MCU,具有256至512KB闪存, USB , CAN ,11个定时器, 3的ADC ,13个通信接口 [High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces]
分类和应用: 闪存通信
文件页数/大小: 123 页 / 1691 K
品牌: STMICROELECTRONICS [ ST ]
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STM32F103xC, STM32F103xD, STM32F103xE  
Package characteristics  
Figure 59. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,  
0.8 mm pitch, package outline  
Seating plane  
C
A2  
A4  
ddd  
C
A
A3  
A1  
B
D
D1  
A
e
F
M
F
E1  
E
e
Øb (144 balls)  
Ball A1  
C
A
B
M
Øeee  
Ø fff  
M
C
X3_ME  
1. Drawing is not to scale.  
Table 64. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,  
0.8 mm pitch, package data  
millimeters  
inches(1)  
Symbol  
Min  
Typ  
Max  
Typ  
Min  
Max  
A
A1  
A2  
A3  
A4  
b
1.70  
0.0669  
0.21  
0.0083  
1.07  
0.27  
0.0421  
0.0106  
0.85  
0.45  
0.0335  
0.0177  
0.3996  
0.35  
9.85  
0.40  
10.00  
8.80  
10.00  
8.80  
0.80  
0.60  
0.10  
0.15  
0.08  
0.0138  
0.3878  
0.0157  
0.3937  
0.3465  
0.3937  
0.3465  
0.0315  
0.0236  
0.0039  
0.0059  
0.0031  
D
10.15  
D1  
E
9.85  
10.15  
0.3878  
0.3996  
E1  
e
F
ddd  
eee  
fff  
1. Values in inches are converted from mm and rounded to 4 decimal digits.  
Doc ID 14611 Rev 7  
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