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STM32F103RET6TR 参数 Datasheet PDF下载

STM32F103RET6TR图片预览
型号: STM32F103RET6TR
PDF下载: 下载PDF文件 查看货源
内容描述: 高密度高性能线的基于ARM的32位MCU,具有256至512KB闪存, USB , CAN ,11个定时器, 3的ADC ,13个通信接口 [High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces]
分类和应用: 闪存通信
文件页数/大小: 123 页 / 1691 K
品牌: STMICROELECTRONICS [ ST ]
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Package characteristics  
STM32F103xC, STM32F103xD, STM32F103xE  
6
Package characteristics  
6.1  
Package mechanical data  
In order to meet environmental requirements, ST offers these devices in different grades of  
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK  
specifications, grade definitions and product status are available at: www.st.com.  
®
ECOPACK is an ST trademark.  
Figure 58. Recommended PCB design rules (0.80/0.75 mm pitch BGA)  
Dpad  
0.37 mm  
0.52 mm typ. (depends on solder mask  
registration tolerance  
Dsm  
Solder paste  
0.37 mm aperture diameter  
– Non solder mask defined pads are recommended  
– 4 to 6 mils screen print  
Dpad  
Dsm  
ai15469  
106/123  
Doc ID 14611 Rev 7