STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
Electrical characteristics
Figure 12. Maximum current consumption in Run mode versus frequency (at 3.6 V) -
code with data processing running from RAM, peripherals enabled
ꢀꢇ
ꢀꢎ
ꢀꢅ
ꢀꢃ
ꢅꢎ -(Z
ꢀꢇ -(Z
ꢍ -(Z
ꢍ
ꢇ
ꢎ
ꢅ
ꢃ
nꢎꢃ
#
ꢅꢁ
#
ꢍꢁ
#
ꢀꢃꢁ #
4EMPERATURE ꢈ #ꢉ
AIꢀꢐꢐꢇꢁ
Figure 13. Maximum current consumption in Run mode versus frequency (at 3.6 V) -
code with data processing running from RAM, peripherals disabled
ꢀꢃ
ꢓ
ꢍ
ꢐ
ꢇ
ꢅꢎ -(Z
ꢀꢇ -(Z
ꢍ -(Z
ꢁ
ꢎ
ꢌ
ꢅ
ꢀ
ꢃ
nꢎꢃ
#
ꢅꢁ
#
ꢍꢁ
#
ꢀꢃꢁ #
4EMPERATURE ꢈ #ꢉ
AIꢀꢐꢐꢇꢇ
Table 14. STM32F100xxB maximum current consumption in Sleep mode, code
running from Flash or RAM
Max(1)
Symbol
Parameter
Conditions
fHCLK
Unit
TA = 85 °C
TA = 105 °C
24 MHz
16 MHz
8 MHz
9.6
7.1
4.5
3.8
3.3
2.7
10
7.5
4.8
4
External clock(2) all
peripherals enabled
Supply current
in Sleep mode
IDD
mA
24 MHz
16 MHz
8 MHz
External clock(2), all
peripherals disabled
3.5
3
1. Based on characterization, tested in production at VDD max and fHCLK max with peripherals enabled.
2. External clock is 8 MHz and PLL is on when fHCLK > 8 MHz.
Doc ID 16455 Rev 2
39/84
STMICROELECTRONICS [ ST ]
