STM32F103xC, STM32F103xD, STM32F103xE
Package characteristics
Figure 63. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package outline
Seating plane
C
A2
A4
ddd
C
A
A3
A1
B
D
D1
A
e
F
M
F
E1
E
e
Øb (144 balls)
Ball A1
C
A
B
M
Øeee
Ø fff
M
C
X3_ME
1. Drawing is not to scale.
Table 66. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package data
millimeters
inches(1)
Symbol
Min
Typ
Max
Typ
Min
Max
A
A1
A2
A3
A4
b
1.70
0.0669
0.21
0.0083
1.07
0.27
0.0421
0.0106
0.85
0.45
0.0335
0.0177
0.3996
0.35
9.85
0.40
10.00
8.80
10.00
8.80
0.80
0.60
0.10
0.15
0.08
0.0138
0.3878
0.0157
0.3937
0.3465
0.3937
0.3465
0.0315
0.0236
0.0039
0.0059
0.0031
D
10.15
D1
E
9.85
10.15
0.3878
0.3996
E1
e
F
ddd
eee
fff
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Doc ID 14611 Rev 8
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STMICROELECTRONICS [ ST ]
