STM32F103xC, STM32F103xD, STM32F103xE
Package characteristics
Figure 65. WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale
package outline
e1
A1 ball corner
e
A1 ball corner
e
D
A
B
C
H
Detail A
D
E
e1
E
F
Notch
G
H
F
L
aaa
Marking area
A2
L
G
2
8
7
6
5
4
3
1
Wafer back side
A
Ball side
Side view
Ball
eee
A1
b
Seating plane (see note 2)
Detail A rotated 90 ˚
CR_ME
1. Drawing is not to scale.
2. Primary datum Z and seating plane are defined by the spherical crowns of the ball.
Table 68. WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale
package mechanical data
millimeters
Typ
inches(1)
Symbol
Min
0.535
Max
0.635
Min
Typ
Max
A
0.585
0.230
0.355
0.320
0.500
3.500
0.447
0.483
4.466
4.395
0.250
0.200
0.05
0.0211
0.0081
0.0130
0.0114
0.0230
0.0091
0.0140
0.0126
0.0197
0.1378
0.0176
0.0190
0.1758
0.1730
0.0098
0.0079
0.0020
0.0039
0.0250
0.0100
0.0150
0.0138
A1
A2
b(2)
e
0.205
0.330
0.290
0.255
0.380
0.350
e1
F
G
D
4.446
4.375
4.486
4.415
0.1750
0.1722
0.1766
0.1738
E
H
L
eee
aaa
0.10
Number of balls
64
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Dimension is measured at the maximum ball diameter parallel to primary datum Z.
Doc ID 14611 Rev 8
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STMICROELECTRONICS [ ST ]
