Package characteristics
STM32F103xC, STM32F103xD, STM32F103xE
Figure 57. LFBGA100 - low profile fine pitch ball grid array package outline
Seating plane
C
ddd
C
A2 A4 A3
A1
A
D
B
D1
F
e
A
K
J
F
H
G
F
E
E1
E
D
C
B
A
e
1
2
3
4
5
6
7 8 9 10
A1 corner index area
(see note 5)
∅b(100 balls)
∅eee
C
C
A
B
M
M
∅
fff
Bottom view
ai14396
Table 64. LFBGA100 - low profile fine pitch ball grid array package mechanical data
mm
inches(1)
Dim.
Min
Typ
Max
Min
Typ
Max
A
1.700
0.0026
A1
A2
A3
A4
b
0.270
0.0004
1.085
0.30
0.0017
0.0005
0.80
0.55
0.0012
0.0009
0.0157
0.45
9.85
0.50
10.00
7.20
10.00
7.20
0.80
1.40
0.12
0.15
0.08
0.0007
0.0153
0.0008
0.0155
0.0111
0.0155
0.0111
0.0012
0.0022
0.0002
0.0002
0.0001
D
10.15
D1
E
9.85
10.15
0.0153
0.0157
E1
e
F
ddd
eee
fff
N (number of balls)
100
1. Values in inches are converted from mm and rounded to 4 decimal digits.
108/118
STMICROELECTRONICS [ ST ]
