Package characteristics
STM32F103x4, STM32F103x6
Figure 44. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package outline
B
A
A1
e
D
D1
A
F
H
G
F
E
E1
D
C
B
A
e
1
A3
A4
A2
Seating
C
plane
Bottom view
ME_R8
F
E
2
3
4
5
6
7
8
A1
ball
pad corner
Øb (64
balls)
1. Drawing is not to scale.
Table 54.
TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package
mechanical data
millimeters
inches
(1)
Max
1.200
0.150
0.785
0.200
0.600
0.250
4.850
0.300
5.000
3.500
4.850
5.000
3.500
0.500
0.750
0.080
0.150
0.050
5.150
0.1909
0.350
5.150
0.0098
0.1909
0.0118
0.1969
0.1378
0.1969
0.1378
0.0197
0.0295
0.0031
0.0059
0.0020
0.2028
0.0059
0.0309
0.0079
0.0236
0.0138
0.2028
Min
Typ
Max
0.0472
Symbol
Min
A
A1
A2
A3
A4
b
D
D1
E
E1
e
F
ddd
eee
fff
Typ
1. Values in inches are converted from mm and rounded to 4 decimal digits.
78/87
Doc ID 15060 Rev 5
STMICROELECTRONICS [ STMICROELECTRONICS ]
