STM32F103x4, STM32F103x6
Package characteristics
Figure 38. VFQFPN36 6 x 6 mm, 0.5 mm pitch,
package outline
(1)
Seating plane
C
A2 A
ddd
C
Figure 39. Recommended footprint
(dimensions in mm)
(1)(2)
4.30
1.00
27
19
A3
E2
b
27
19
A1
28
18
4.10
0.50
28
18
4.30
4.80
4.10
4.80
e
D
D2
36
10
0.75
1
9
36
0.30
10
1
E
9
L
ZR_ME
6.30
ai14870b
Pin # 1 ID
R = 0.20
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead solder joint life.
Table 51.
Symbol
VFQFPN36 6 x 6 mm, 0.5 mm pitch, package mechanical data
millimeters
Min
Typ
0.900
0.020
0.650
0.250
0.180
5.875
1.750
5.875
1.750
0.450
0.350
0.230
6.000
3.700
6.000
3.700
0.500
0.550
0.080
0.300
6.125
4.250
6.125
4.250
0.550
0.750
0.0071
0.2313
0.0689
0.2313
0.0689
0.0177
0.0138
Max
1.000
0.050
1.000
Min
0.0315
inches
(1)
Typ
0.0354
0.0008
0.0256
0.0098
0.0091
0.2362
0.1457
0.2362
0.1457
0.0197
0.0217
0.0031
0.0118
0.2411
0.1673
0.2411
0.1673
0.0217
0.0295
Max
0.0394
0.0020
0.0394
A
A1
A2
A3
b
D
D2
E
E2
e
L
ddd
0.800
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Doc ID 15060 Rev 5
75/87
STMICROELECTRONICS [ STMICROELECTRONICS ]
