Package characteristics
STM32F103x4, STM32F103x6
Figure 40. VFQFPN48 7 x 7 mm, 0.5 mm pitch, package Figure 41. Recommended footprint
outline
(1)
(dimensions in mm)
(1)(2)
C
A2
A
ddd C
Seating
Plane
5.80
0.75
A3
A1
D
e
Pin no. 1 ID
R = 0.20
1
48
37
36
37
5.60
48
0.20
36
1
5.80
6.20
0.30
6.20
5.60
E2
b
e
E
12
13
24
25
0.55
0.50
L
7.30
ai15799
25
12
24
13
b
Bottom View
D2
L
V0_ME
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead solder joint life.
Table 52.
Symbol
VFQFPN48 7 x 7 mm, 0.5 mm pitch, package mechanical data
millimeters
Min
Typ
0.900
0.020
0.650
0.250
0.180
6.850
2.250
6.850
2.250
0.450
0.300
0.230
7.000
4.700
7.000
4.700
0.500
0.400
0.080
0.300
7.150
5.250
7.150
5.250
0.550
0.500
0.0071
0.2697
0.0886
0.2697
0.0886
0.0177
0.0118
Max
1.000
0.050
1.000
Min
0.0315
inches
(1)
Typ
0.0354
0.0008
0.0256
0.0098
0.0091
0.2756
0.1850
0.2756
0.1850
0.0197
0.0157
0.0031
0.0118
0.2815
0.2067
0.2815
0.2067
0.0217
0.0197
Max
0.0394
0.0020
0.0394
A
A1
A2
A3
b
D
D2
E
E2
e
L
ddd
0.800
1. Values in inches are converted from mm and rounded to 4 decimal digits.
76/87
Doc ID 15060 Rev 5
STMICROELECTRONICS [ STMICROELECTRONICS ]
