STM32F103xx
Package characteristics
6
Package characteristics
Figure 27. LFBGA100 - low profile fine pitch ball grid array package outline
Seating plane
C
ddd
C
A2 A4 A3
B
A1
A
D
D1
F
e
A
K
J
F
H
G
F
E
E1
E
D
C
B
A
e
1
2
3
4
5
6
7 8 9 10
A1 corner index area
(see note 5)
b
(100 balls)
eee
C
C
A
B
M
M
fff
Bottom view
ai14396
Table 42. LFBGA100 - low profile fine pitch ball grid array package mechanical data
mm
Typ
inches
Typ
Dim.
Min
Max
Min
Max
A
1.700
0.067
A1
A2
A3
A4
b
0.270
0.011
1.085
0.30
0.043
0.012
0.80
0.55
0.031
0.022
0.40
0.45
9.85
0.50
10.00
7.20
0.018
0.388
0.020
0.394
0.283
0.394
0.283
0.031
0.055
D
10.15
D1
E
9.85
10.00
7.20
10.15
0.388
0.40
E1
e
0.80
F
1.40
ddd
eee
fff
0.12
0.15
0.08
0.005
0.006
0.003
N (number of balls)
100
59/67
STMICROELECTRONICS [ ST ]
