Typical system block diagram
L6599
Table 1.
Pin functions
Low-side gate-drive output. The driver is capable of 0.3A min. source and 0.8A min. sink
peak current to drive the lower MOSFET of the half-bridge leg. The pin is actively pulled to
11
LVG
GND during UVLO.
Supply Voltage of both the signal part of the IC and the low-side gate driver. Sometimes a
small bypass capacitor (0.1µF typ.) to GND might be useful to get a clean bias voltage for
the signal part of the IC.
12
VCC
High-voltage spacer. The pin is not internally connected to isolate the high-voltage pin and
ease compliance with safety regulations (creepage distance) on the PCB.
13
14
N.C.
OUT
High-side gate-drive floating ground. Current return for the high-side gate-drive current.
Layout carefully the connection of this pin to avoid too large spikes below ground.
High-side floating gate-drive output. The driver is capable of 0.3A min. source and 0.8A min.
sink peak current to drive the upper MOSFET of the half-bridge leg. A resistor internally
connected to pin 14 (OUT) ensures that the pin is not floating during UVLO.
15
16
HVG
High-side gate-drive floating supply Voltage. The bootstrap capacitor connected between
this pin and pin 14 (OUT) is fed by an internal synchronous bootstrap diode driven in-phase
with the low-side gate-drive. This patented structure replaces the normally used external
diode.
VBOOT
3
Typical system block diagram
Figure 2. Typical system block diagram
6/36
STMICROELECTRONICS [ ST ]
