SGA-8343X Reliability Qualification Report
Group A1a
Test Conditions
Number of
Devices Under
Test
Group A1b
Test Conditions
Number of
Devices Under
Test
Group A2
Test Conditions
Number of
Devices Under
Test
Group B
Test Conditions
Number of
Devices Under
Test
Group C
Test Conditions
Number of
Devices Under
Test
Temperature Cycling (Air to Air Thermal Shock) – Soldered on PCB
Temperature Range -65°C to 165°C, 10 min dwell, 1 minute transition,
1000 cycles
17
Test
Standard
JESD22-
A104(B)
Results
Pass
Temperature Cycling (Air to Air Thermal Shock)
Temperature Range -65°C to 165°C, 10 min dwell, 1 minute transition,
1000 cycles
25
Test
Standard
JESD22-
A104(B)
Results
PASS
High Temperature Operating Life Test
Junction Temperature = 150°C, Test Duration = 1000 hours
80
Test
Standard
JESD22-
A108(B)
Results
PASS
HAST
Temperature = 110°C, 85% Relative Humidity, Test Duration = 264 hours
15
(1)
Test
Standard
JESD22-
A110(B)
Results
PASS
Autoclave
Temperature = 121°C, Relative Humidity = 100%, Test Duration = 96
hours
40
Test
Standard
JESD22-
A102(C)
Results
PASS
STANFORD [ STANFORD MICRODEVICES ]
