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SST39SF040-70-4C-WHE 参数 Datasheet PDF下载

SST39SF040-70-4C-WHE图片预览
型号: SST39SF040-70-4C-WHE
PDF下载: 下载PDF文件 查看货源
内容描述: 1兆位/ 2兆位/ 4兆位( X8 )多用途闪存 [1 Mbit / 2 Mbit / 4 Mbit (x8) Multi-Purpose Flash]
分类和应用: 闪存内存集成电路光电二极管
文件页数/大小: 24 页 / 380 K
品牌: SST [ SILICON STORAGE TECHNOLOGY, INC ]
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash  
SST39SF010A / SST39SF020A / SST39SF040  
Data Sheet  
TABLE 4: SOFTWARE COMMAND SEQUENCE  
Command  
Sequence  
1st Bus  
Write Cycle  
2nd Bus  
Write Cycle  
3rd Bus  
Write Cycle  
4th Bus  
Write Cycle  
5th Bus  
Write Cycle  
6th Bus  
Write Cycle  
Addr1 Data Addr1 Data Addr1 Data Addr1 Data Addr1 Data Addr1 Data  
5555H AAH 2AAAH 55H 5555H A0H Data  
BA2  
5555H AAH 2AAAH 55H 5555H 80H 5555H AAH 2AAAH 55H  
Byte-Program  
3
Sector-Erase  
SAX  
30H  
Chip-Erase  
5555H AAH 2AAAH 55H 5555H 80H 5555H AAH 2AAAH 55H 5555H 10H  
5555H AAH 2AAAH 55H 5555H 90H  
Software ID Entry4,5  
Software ID Exit6  
Software ID Exit6  
XXH  
F0H  
5555H AAH 2AAAH 55H 5555H F0H  
T4.2 1147  
1. Address format A14-A0 (Hex), Addresses AMS-A15 can be VIL or VIH, but no other value, for the Command sequence.  
MS = Most significant address  
A
AMS = A16 for SST39SF010A, A17 for SST39SF020A, and A18 for SST39SF040  
2. BA = Program Byte address  
3. SAX for Sector-Erase; uses AMS-A12 address lines  
4. The device does not remain in Software Product ID mode if powered down.  
5. With AMS-A1 = 0; SST Manufacturer’s ID = BFH, is read with A0 = 0,  
SST39SF010A Device ID = B5H, is read with A0 = 1  
SST39SF020A Device ID = B6H, is read with A0 = 1  
SST39SF040 Device ID = B7H, is read with A0 = 1  
6. Both Software ID Exit operations are equivalent  
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum  
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation  
of the device at these conditions or conditions greater than those defined in the operational sections of this data  
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)  
Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C  
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C  
D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VDD+0.5V  
Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-2.0V to VDD+2.0V  
Voltage on A9 Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 13.2V  
Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W  
Through Hold Lead Soldering Temperature (10 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C  
Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C  
Output Short Circuit Current1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA  
1. Outputs shorted for no more than one second. No more than one output shorted at a time.  
OPERATING RANGE  
Range  
Ambient Temp  
0°C to +70°C  
VDD  
Commercial  
Industrial  
4.5-5.5V  
4.5-5.5V  
-40°C to +85°C  
AC CONDITIONS OF TEST  
Input Rise/Fall Time . . . . . . . . . . . . . . 5 ns  
Output Load . . . . . . . . . . . . . . . . . . . . . CL = 30 pF for 45 ns  
Output Load . . . . . . . . . . . . . . . . . . . . . CL = 100 pF for 70 ns  
See Figures 13 and 14  
©2003 Silicon Storage Technology, Inc.  
S71147-06-000  
8/04  
7