4 Mbit SPI Serial Flash
SST25VF040B
Data Sheet
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Pin #1
0.2
Pin #1
Corner
1.27 BSC
4.0
5.00 0.10
0.076
0.48
0.35
3.4
0.70
0.50
0.05 Max
6.00 0.10
0.80
0.70
CROSS SECTION
Note: 1. All linear dimensions are in millimeters (max/min).
2. Untoleranced dimensions (shown with box surround)
are nominal target dimensions.
0.80
0.70
3. The external paddle is electrically connected to the
die back-side and possibly to certain V leads.
1mm
SS
This paddle can be soldered to the PC board;
8-wson-5x6-QA-9.0
it is suggested to connect this paddle to the V of the unit.
SS
Connection of this paddle to any other voltage potential can
result in shorts and/or electrical malfunction of the device.
FIGURE 30: 8-Contact Very-very-thin Small Outline No-lead (WSON)
SST Package Code: QA
TABLE 13: Revision History
Number
00
Description
Date
Sep 2005
Jan 2006
•
•
•
•
•
•
•
Initial release of data sheet
01
Migrated document to a Data Sheet
Updated Surface Mount Solder Reflow Temperature information
Added 8-Lead SOIC (150 mils) package drawing.
Updated Features and Product Description to include new package information.
Updated Pin-Assignment, Figure 2
02
Jul 2007
Revised Figure 10 and Figure 11
Silicon Storage Technology, Inc. • 1171 Sonora Court • Sunnyvale, CA 94086 • Telephone 408-735-9110 • Fax 408-735-9036
www.SuperFlash.com or www.sst.com
©2007 Silicon Storage Technology, Inc.
S71295-02-000
7/07
30