Da ta
Shee t
(Prelimi nar y)
7.1.2
63-Pin Ball Grid Array (BGA)
Figure 7.2
VBM063 — 63-Pin BGA, 11 mm x 9 mm Package
NOTES:
PACKAGE
JEDEC
DXE
SYMBOL
A
A1
D
E
D1
E1
MD
ME
n
Øb
eE
eD
SD
SE
0.40
VBM 063
M0-207(M)
NOTE
11.00 mm x 9.00 mm
PACKAGE
MIN
---
0.25
NOM
---
---
11.00 BSC
9.00 BSC
8.80 BSC
7.20 BSC
12
10
63
0.45
0.80 BSC
0.80 BSC
0.40 BSC
0.40 BSC
A3-A8,B2-B8,C1,C2,C9,C10
D1,D2,D9,D10,E1,E2,E9,E10
F1,F2,F9,F10,G1,G2,G9,G10
H1,H2,H9,H10,J1,J2,J9,J10
K1,K2,K9,K10,L3-L8,M3-M8
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JEP 95, SECTION 4.3,
SPP-010.
MAX
1.00
---
PROFILE
BALL HEIGHT
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
0.50
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION.
n IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
7
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
9
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
g1018-1 \ f16-038.25 \ 11.04.11
September 6, 2012 S34ML01G1_04G1_10
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®
SLC NAND Flash Memory for Embedded
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