P R E L I M I N A R Y
Connection Diagrams
80-Ball Fine-pitch BGA
80-Ball Fine-pitch BGA
(PL127J/PL129J)
Top View, Balls Facing Down
A8
NC
B8
NC
C8
NC
D8
E8
F8
G8
H8
NC
J8
K8
NC
L8
M8
NC
A22
NC
V
V
NC
NC
IO
SS
A7
NC
B7
NC
C7
D7
E7
F7
G7
H7
NC
J7
K7
L7
M7
NC
A13
A12
A14
A15
A16
DQ15
V
NC
SS
C6
A9
D6
A8
E6
F6
G6
H6
J6
K6
A10
A11
DQ7
DQ14
DQ13
DQ6
C5
D5
E5
F5
G5
H5
J5
K5
WE#
RESET#
A21
A19
DQ5
DQ12
V
DQ4
CC
C4
D4
E4
F4
G4
H4
J4
K4
RY/BY# WP#/ACC
A18
A20
DQ2
DQ10
DQ11
DQ3
C3
A7
D3
E3
A6
F3
A5
G3
H3
J3
K3
A17
DQ0
DQ8
DQ9
DQ1
A2
NC
B2
NC
C2
A3
D2
A4
E2
A2
F2
A1
G2
A0
H2
J2
K2
L2
M2
NC
CE#
OE#
V
SS
NC
A1
NC
B1
NC
C1
NC
D1
NC
E1
F1
G1
NC
H1
J1
K1
NC
L1
M1
NC
NC
NC
V
IO
NC
NC
Note: Pinout shown for PL127J, for PL129J, H7(NC)= CE2# and H2 (CE#) = CE1#
Special Package Handling Instructions
Special handling is required for Flash Memory products in molded packages
(TSOP, BGA, PDIP, SSOP, PLCC).
The package and/or data integrity may be compromised if the package body is
exposed to temperatures above 150°C for prolonged periods of time.
April 7, 2005 31107A62
S29PL127J/S29PL129J/S29PL064J/S29PL032J
15
SPANSION [ SPANSION ]
