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S29GL128P90FFIR10 参数 Datasheet PDF下载

S29GL128P90FFIR10图片预览
型号: S29GL128P90FFIR10
PDF下载: 下载PDF文件 查看货源
内容描述: 3.0伏只页面模式闪存具有90纳米的MirrorBit工艺技术 [3.0 Volt-only Page Mode Flash Memory featuring 90 nm MirrorBit Process Technology]
分类和应用: 闪存存储
文件页数/大小: 77 页 / 2742 K
品牌: SPANSION [ SPANSION ]
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D a t a S h e e t ( P r e l i m i n a r y )  
4.4  
TS056—56-Pin Standard Thin Small Outline Package (TSOP)  
Figure 4.4 56-Pin Thin Small Outline Package (TSOP), 14 x 20 mm  
NOTES:  
PACKAGE  
TS 56  
JEDEC  
MO-142 (B) EC  
1
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm).  
(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982.)  
SYMBOL  
MIN.  
---  
NOM.  
---  
MAX.  
1.20  
0.15  
1.05  
0.23  
0.27  
0.16  
0.21  
2
3
PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).  
A
A1  
A2  
b1  
b
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS  
DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE  
LEADS ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.  
0.05  
0.95  
0.17  
0.17  
0.10  
0.10  
---  
1.00  
0.20  
0.22  
---  
4
5
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE  
MOLD PROTUSION IS 0.15 mm PER SIDE.  
c1  
c
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE  
DAMBAR PROTUSION SHALL BE 0.08 mm TOTAL IN EXCESS OF b  
DIMENSION AT MAX MATERIAL CONDITION. MINIMUM SPACE BETWEEN  
PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 mm.  
---  
D
19.80  
18.30  
20.00  
18.40  
20.20  
18.50  
D1  
6
7
8
THESE DIMESIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN  
0.10 mm AND 0.25 mm FROM THE LEAD TIP.  
E
e
13.90  
14.00  
14.10  
0.50 BASIC  
LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED FROM THE  
SEATING PLANE.  
L
0.50  
0˚  
0.60  
-
0.70  
8˚  
O
R
N
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.  
0.08  
---  
56  
0.20  
3160\38.10A  
16  
S29GL-P MirrorBit® Flash Family  
S29GL-P_00_A7 November 8, 2007  
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