D a t a S h e e t ( P r e l i m i n a r y )
4.4
TS056—56-Pin Standard Thin Small Outline Package (TSOP)
Figure 4.4 56-Pin Thin Small Outline Package (TSOP), 14 x 20 mm
NOTES:
PACKAGE
TS 56
JEDEC
MO-142 (B) EC
1
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm).
(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982.)
SYMBOL
MIN.
---
NOM.
---
MAX.
1.20
0.15
1.05
0.23
0.27
0.16
0.21
2
3
PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
A
A1
A2
b1
b
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS
DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE
LEADS ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.
0.05
0.95
0.17
0.17
0.10
0.10
---
1.00
0.20
0.22
---
4
5
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
MOLD PROTUSION IS 0.15 mm PER SIDE.
c1
c
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE
DAMBAR PROTUSION SHALL BE 0.08 mm TOTAL IN EXCESS OF b
DIMENSION AT MAX MATERIAL CONDITION. MINIMUM SPACE BETWEEN
PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 mm.
---
D
19.80
18.30
20.00
18.40
20.20
18.50
D1
6
7
8
THESE DIMESIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN
0.10 mm AND 0.25 mm FROM THE LEAD TIP.
E
e
13.90
14.00
14.10
0.50 BASIC
LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED FROM THE
SEATING PLANE.
L
0.50
0˚
0.60
-
0.70
8˚
O
R
N
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
0.08
---
56
0.20
3160\38.10A
16
S29GL-P MirrorBit® Flash Family
S29GL-P_00_A7 November 8, 2007
SPANSION [ SPANSION ]
