D a t a S h e e t ( P r e l i m i n a r y )
3. Block Diagram
Figure 3.1 S29GL-P Block Diagram
DQ15–DQ0
RY/BY#
V
CC
Sector Switches
V
SS
V
IO
Erase Voltage
Generator
Input/Output
Buffers
RESET#
WE#
WP#/ACC
BYTE#
State
Control
Command
Register
PGM Voltage
Generator
Data
Latch
Chip Enable
Output Enable
STB
CE#
OE#
Logic
Y-Decoder
STB
Y-Gating
V
Detector
Timer
CC
Cell Matrix
X-Decoder
A
**–A0 (A-1)
Max
** A
GL01GP=A25, A
GL512P = A24, A
GL256P = A23, A
GL128P = A22
Max
Max
Max
Max
4. Physical Dimensions/Connection Diagrams
This section shows the I/O designations and package specifications for the S29GL-P family.
4.1
4.2
Related Documents
The following documents contain information relating to the S29GL-P devices. Click on the title or go to
www.spansion.com download the PDF file, or request a copy from your sales office.
Considerations for X-ray Inspection of Surface-Mounted Flash Integrated Circuits
Special Handling Instructions for BGA Package
Special handling is required for Flash Memory products in BGA packages.
Flash memory devices in BGA packages may be damaged if exposed to ultrasonic cleaning methods. The
package and/or data integrity may be compromised if the package body is exposed to temperatures above
150°C for prolonged periods of time.
12
S29GL-P MirrorBit® Flash Family
S29GL-P_00_A7 November 8, 2007
SPANSION [ SPANSION ]
