D a t a S h e e t
17.3 VBK048—Ball Fine-pitch Ball Grid Array (BGA) 8.15x 6.15 mm Package
0.10 (4X)
D1
A
D
6
5
4
3
2
1
7
e
SE
E1
E
H
G
F
E
D
C
B
A
INDEX MARK
10
6
B
A1 CORNER
PIN A1
CORNER
7
φb
SD
φ 0.08 M C
φ 0.15 M C A B
TOP VIEW
BOTTOM VIEW
0.10
C
A2
A
SEATING PLANE
SIDE VIEW
0.08
C
C
A1
NOTES:
PACKAGE
JEDEC
VBK 048
N/A
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
8.15 mm x 6.15 mm NOM
PACKAGE
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
SYMBOL
MIN
---
NOM
MAX
1.00
---
NOTE
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
A
A1
A2
D
---
OVERALL THICKNESS
BALL HEIGHT
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
0.18
0.62
---
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
---
8.15 BSC.
6.15 BSC.
5.60 BSC.
4.00 BSC.
8
0.76
BODY THICKNESS
BODY SIZE
N IS THE TOTAL NUMBER OF SOLDER BALLS.
E
BODY SIZE
6
7
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
D1
E1
MD
ME
N
BALL FOOTPRINT
BALL FOOTPRINT
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
6
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
48
φb
0.35
---
0.43
BALL DIAMETER
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
e
0.80 BSC.
0.40 BSC.
---
BALL PITCH
SD / SE
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3338 \ 16-038.25 \ 10.05.04
76
S29GL-N MirrorBit® Flash Family
S29GL-N_01_09 November 16, 2007
SPANSION [ SPANSION ]
