欢迎访问ic37.com |
会员登录 免费注册
发布采购

S29GL064N90TFI070 参数 Datasheet PDF下载

S29GL064N90TFI070图片预览
型号: S29GL064N90TFI070
PDF下载: 下载PDF文件 查看货源
内容描述: 64兆, 32兆3.0伏只页面模式闪存设有110纳米的MirrorBit工艺技术 [64 Megabit, 32 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 110 nm MirrorBit Process Technology]
分类和应用: 闪存
文件页数/大小: 79 页 / 3123 K
品牌: SPANSION [ SPANSION ]
 浏览型号S29GL064N90TFI070的Datasheet PDF文件第71页浏览型号S29GL064N90TFI070的Datasheet PDF文件第72页浏览型号S29GL064N90TFI070的Datasheet PDF文件第73页浏览型号S29GL064N90TFI070的Datasheet PDF文件第74页浏览型号S29GL064N90TFI070的Datasheet PDF文件第75页浏览型号S29GL064N90TFI070的Datasheet PDF文件第77页浏览型号S29GL064N90TFI070的Datasheet PDF文件第78页浏览型号S29GL064N90TFI070的Datasheet PDF文件第79页  
D a t a S h e e t  
17.3 VBK048—Ball Fine-pitch Ball Grid Array (BGA) 8.15x 6.15 mm Package  
0.10 (4X)  
D1  
A
D
6
5
4
3
2
1
7
e
SE  
E1  
E
H
G
F
E
D
C
B
A
INDEX MARK  
10  
6
B
A1 CORNER  
PIN A1  
CORNER  
7
φb  
SD  
φ 0.08 M C  
φ 0.15 M C A B  
TOP VIEW  
BOTTOM VIEW  
0.10  
C
A2  
A
SEATING PLANE  
SIDE VIEW  
0.08  
C
C
A1  
NOTES:  
PACKAGE  
JEDEC  
VBK 048  
N/A  
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.  
2. ALL DIMENSIONS ARE IN MILLIMETERS.  
8.15 mm x 6.15 mm NOM  
PACKAGE  
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT  
AS NOTED).  
SYMBOL  
MIN  
---  
NOM  
MAX  
1.00  
---  
NOTE  
4.  
e REPRESENTS THE SOLDER BALL GRID PITCH.  
A
A1  
A2  
D
---  
OVERALL THICKNESS  
BALL HEIGHT  
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE  
"D" DIRECTION.  
0.18  
0.62  
---  
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE  
"E" DIRECTION.  
---  
8.15 BSC.  
6.15 BSC.  
5.60 BSC.  
4.00 BSC.  
8
0.76  
BODY THICKNESS  
BODY SIZE  
N IS THE TOTAL NUMBER OF SOLDER BALLS.  
E
BODY SIZE  
6
7
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL  
DIAMETER IN A PLANE PARALLEL TO DATUM C.  
D1  
E1  
MD  
ME  
N
BALL FOOTPRINT  
BALL FOOTPRINT  
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS  
A AND B AND DEFINE THE POSITION OF THE CENTER  
SOLDER BALL IN THE OUTER ROW.  
ROW MATRIX SIZE D DIRECTION  
ROW MATRIX SIZE E DIRECTION  
TOTAL BALL COUNT  
6
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN  
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,  
RESPECTIVELY, SD OR SE = 0.000.  
48  
φb  
0.35  
---  
0.43  
BALL DIAMETER  
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN  
THE OUTER ROW, SD OR SE = e/2  
e
0.80 BSC.  
0.40 BSC.  
---  
BALL PITCH  
SD / SE  
SOLDER BALL PLACEMENT  
DEPOPULATED SOLDER BALLS  
8. NOT USED.  
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED  
BALLS.  
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK  
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.  
3338 \ 16-038.25 \ 10.05.04  
76  
S29GL-N MirrorBit® Flash Family  
S29GL-N_01_09 November 16, 2007