Ordering Information
Standard Products
Spansion standard products are available in several packages and operating
ranges. The order number (Valid Combination) is formed by a combination of the
elements below.
S29AL016M 90
T
A
I
01
2
PACKING TYPE
0
2
3
=
=
=
Tray
7” Tape & Reel
13” Tape & Reel
ADDITIONAL ORDERING OPTIONS
01
R1
02
R2
=
=
=
=
x8/x16, VCC= 2.7–3.6 V, top boot sector device
x8/x16, VCC= 3.0–3.6 V, top boot sector device
x8/x16, VCC= 2.7–3.6 V, bottom boot sector device
x8/x16, VCC= 3.0–3.6 V, bottom boot sector device
TEMPERATURE RANGE
I
=
Industrial (–40
°
C to +85 C)
°
PACKAGE MATERIAL SET
A
F
=
=
Standard
Pb-free
PACKAGE TYPE
T
B
F
=
=
=
Thin Small Outline Package (TSOP) Standard Pinout
Fine-Pitch Ball Grid Array (BGA)
Fortified Ball Grid Array (BGA)
SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER/DESCRIPTION
S29AL016M
16 Megabit (2M x 8-Bit/1M x 16-Bit) MirrorBitTM Flash Memory
3.0 Volt-only Read, Program, and Erase
Valid Combinations
Valid Combinations for BGA Packages
for TSOP Packages
Package
Order Number
Package
01
R1
02
R2
BAI
BFI
S29AL016M90
S29AL016M10
TAI
TFI
01
R1
02
R2
FBA048
LAA064
TS048
S29AL016M90
S29AL016M10
FAI
FFI
Note: Characters 1-16 of the OPN represent the TSOP
package marking. For example, the package marking for
OPN S29AL016M90TAI010 is “S29AL016M90TAI01”
Note: Characters 4-16 of the OPN represent the BGA pack-
age marking. For example the package marking for OPN
S29AL016M90BAI010 is “AL016M90BAI01”
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this
device. Consult your local sales office to confirm availability of specific valid com-
binations and to check on newly released combinations.
April 21, 2004 S29AL016M_00A4
S29AL016M
10
SPANSION [ SPANSION ]
