Connection Diagrams
64-Ball Fortified BGA
Top View, Balls Facing Down
A8
NC
B8
NC
C8
NC
D8
NC
E8
F8
G8
NC
H8
NC
VSS
NC
A7
B7
C7
D7
E7
F7
G7
H7
A12
A14
A15
A16
BYTE# DQ15/A-1
VSS
A13
A6
A9
B6
A8
C6
D6
E6
F6
G6
H6
A10
A11
DQ7
DQ14
DQ13
DQ6
A5
B5
C5
NC
D5
E5
F5
G5
H5
RESET#
A19
DQ5
DQ12
VCC
DQ4
WE#
A4
B4
NC
C4
D4
NC
E4
F4
G4
H4
RY/BY#
A18
DQ2
DQ10
DQ11
DQ3
A3
A7
B3
C3
A6
D3
A5
E3
F3
G3
H3
A17
DQ0
DQ8
DQ9
DQ1
A2
A3
B2
A4
C2
A2
D2
A1
E2
A0
F2
G2
H2
VSS
CE#
OE#
A1
NC
B1
NC
C1
NC
D1
NC
E1
F1
G1
NC
H1
NC
NC
NC
Special Package Handling Instructions
Special handling is required for Flash Memory products in molded packages
(TSOP, BGA, SSOP, PDIP, PLCC). The package and/or data integrity may be
compromised if the package body is exposed to temperatures above 150°C for
prolonged periods of time.
April 21, 2004 S29AL016M_00A4
S29AL016M
8
SPANSION [ SPANSION ]
