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S29AL008D70TAI020 参数 Datasheet PDF下载

S29AL008D70TAI020图片预览
型号: S29AL008D70TAI020
PDF下载: 下载PDF文件 查看货源
内容描述: 8兆位( 1一M× 8位/ 512的K× 16位) CMOS 3.0伏只引导扇区闪存 [8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 3.0 Volt-only Boot Sector Flash Memory]
分类和应用: 闪存内存集成电路光电二极管
文件页数/大小: 55 页 / 1519 K
品牌: SPANSION [ SPANSION ]
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D a t a S h e e t  
Physical Dimensions  
VBK 048 - 48 Ball Fine-Pitch Ball Grid Array (FBGA) 8.15 x 6.15 mm  
0.10 (4X)  
D1  
A
D
6
5
4
3
2
1
7
e
SE  
E1  
E
H
G
F
E
D
C
B
A
INDEX MARK  
10  
6
B
A1 CORNER  
PIN A1  
CORNER  
7
fb  
SD  
f 0.08 M  
C
TOP VIEW  
f 0.15 M C A B  
BOTTOM VIEW  
0.10 C  
0.08 C  
A2  
A
SEATING PLANE  
SIDE VIEW  
C
A1  
NOTES:  
PACKAGE  
JEDEC  
VBK 048  
N/A  
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.  
2. ALL DIMENSIONS ARE IN MILLIMETERS.  
6.15 mm x 8.15 mm NOM  
PACKAGE  
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT  
AS NOTED).  
SYMBOL  
MIN  
---  
NOM  
MAX  
1.00 OVERALL THICKNESS  
--- BALL HEIGHT  
NOTE  
4.  
e
REPRESENTS THE SOLDER BALL GRID PITCH.  
A
A1  
A2  
D
---  
---  
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE  
"D" DIRECTION.  
0.18  
0.62  
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE  
"E" DIRECTION.  
---  
0.76 BODY THICKNESS  
BODY SIZE  
8.15 BSC.  
6.15 BSC.  
5.60 BSC.  
4.00 BSC.  
8
N IS THE TOTAL NUMBER OF SOLDER BALLS.  
E
BODY SIZE  
6
7
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL  
DIAMETER IN A PLANE PARALLEL TO DATUM C.  
D1  
E1  
BALL FOOTPRINT  
BALL FOOTPRINT  
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS  
A AND B AND DEFINE THE POSITION OF THE CENTER  
SOLDER BALL IN THE OUTER ROW.  
MD  
ME  
N
ROW MATRIX SIZE D DIRECTION  
ROW MATRIX SIZE E DIRECTION  
TOTAL BALL COUNT  
6
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN  
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,  
RESPECTIVELY, SD OR SE = 0.000.  
48  
fb  
0.35  
---  
0.43 BALL DIAMETER  
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN  
THE OUTER ROW, SD OR SE = e/2  
e
0.80 BSC.  
0.40 BSC.  
---  
BALL PITCH  
SD / SE  
SOLDER BALL PLACEMENT  
DEPOPULATED SOLDER BALLS  
8. NOT USED.  
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED  
BALLS.  
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK  
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.  
3338 \ 16-038.25b  
52  
S29AL008D  
S29AL008D_00A3 June 16, 2005