A d v a n c e I n f o r m a t i o n
Ordering Information
Standard Products
Spansion standard products are available in several packages and operating
ranges. The order number (Valid Combination) is formed by a combination of the
elements below.
S29AL004D
70
T
A
I
01
0
PACKING TYPE
0
2
3
=
=
=
Tray
7” Tape and Reel
13” Tape and Reel
MODEL NUMBER
01
02
=
=
VCC = 2.7 - 3.6V, top boot sector device
VCC = 2.7 - 3.6V, bottom boot sector device
TEMPERATURE RANGE
I
=
Industrial (–40
°
C to +85 C)
°
PACKAGE MATERIAL SET
A
F
=
=
Standard
Pb-Free
PACKAGE TYPE
T
B
M
=
=
=
Thin Small Outline Package (TSOP) Standard Pinout
Fine-pitch Ball-Grid Array Package
Small Outline package (SO)
SPEED OPTION
70
90
=
=
70 ns Access Speed
90 ns Access Speed
DEVICE NUMBER/DESCRIPTION
S29AL004D
4 Megabit Flash Memory manufactured using 200 nm process technology
3.0 Volt-only Read, Program, and Erase
S29AL004D Valid Combinations
Package Type,
Package Description
Speed
Option
Model
Device Number
S29AL004D
Material, and
Temperature Range
Packing Type
Number
TAI, TFI
BAI, BFI
MAI, MFI
TS048 (Note 2)
TSOP
Fine-Pitch BGA
SOP
70, 90
01, 02
0, 2, 3 (Note 1)
VBK048 (Note 3)
SO044
Notes:
1. Type 0 is standard. Specify other options as required: TSOPs and SOs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2,
or 3.
2. TSOP package marking omits packing type designator from ordering part number.
3. BGA package marking omits leading S29 and packing type designator from ordering part number.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device.
Consult your local sales office to confirm availability of specific valid combinations and to
check on newly released combinations.
10
S29AL004D
S29AL004D_00_A1 February 18, 2005